| OCR Text |
Show 127 10. Nanz, G., Dickinger, P., AND Selberherr, S. Calculation of contact currents in device simulation. IEEE Trans. Computer-Aided Design CA0-11, 1 (Jan. 1992), 128-136. 11. Kernighan, B. W., AND Pike, R. The Unix Programming Environment, Prentice-Hall, Englewood Cliffs, NJ., 1984. 12. Barna, A. Very High Speed Integrated Circuits Technologies and Tradeoffs. John Wiley & Sons, New York, NY., 1981. 13. Hewlett Packard CMOS Process Design Guide. Hewlett Packard Inc. San Jose, Ca. 14. Su, S., Rao, V., AND Trick, T. HPEX: A hierarchical parasitic circuit extractor. In Proceedings of the 24th Design Automation Conference (June 1987). IEEE, New York, 1987, pp. 566-569. 15. Nabors, K., AND White, J. FastCap: A multipole accelerated 3- dimensional capacitance extraction program. IEEE Trans. ComputerAided Design, CAD-10, 11 (Nov. 1991), 1447-1459. 16. Raghavan, V., Bracken, J., AND Rohrer, R., AWESpice: a general tool for the accurate and efficient simulation of interconnect problems. In Proceedings of the 29th Design Automation Conference (June 1992). IEEE, New York, pp. 87-92. 17. Huang, X., Raghavan, V., AND Rohrer, R. AWEsim: A program for the efficient analysis of linear(ized) circuits, In Proceedings of the International Conference on Computer-Aided Design (November 1990). IEEE, New York, 1990, pp. 534-537. 18. Lee, J. Y., AND Rohrer, R. A. AWEsymbolic: Compiled analysis of linear(ized) circuits using asymptotic waveform evaluation. In Proceedings of the 29th Design Automation Conference (June 1992). IEEE, New York, 1992, pp. 213-218. 19. Matthei, G. L., Chinn, G., Plott, C. H., AND Dagli, N. A simplified means for computation of interconnect distributed capacitances and inductances. Journal of Computer Aided Design, (Feb. 1992). 20. Ling, D. D., Kim, S., AND White, J. A boundary-element approach to transient simulation of three-dimensional integrated circuit interconnect. In Proceedings of the 29th Design Automation Conference (June 1992). IEEE, New York, 1992, pp. 93-98. |