UScholar Works
 
Filters: Collection: "ir_uspace" Subject: "Tantalum nitride"
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CreatorTitleDescriptionSubjectDate
1 Tiwari, AshutoshSelf-aligned passivated copper interconnects: a novel technique for making interconnections in ultra large scale integration device applicationsWe have developed a technique to grow self-aligned epitaxial Cu/MgO films on Si (100) using a Pulsed Laser Deposition Method. In this method we deposit a uniform film of Cu/Mg (5-7%) alloy over Si (100) at room temperature using TiN as an intermediate buffer layer. As a result of HRTEM (with spatial...Passivated copper interconnects; Diffusion barriers; Copper diffusion; Tantalum nitride2002
2 Tiwari, AshutoshSingle crystal TaN thin films on TiN/Si heterostructureWe have successfully grown epitaxial cubic (Bl-NaCl structure) tantalum nitride films on Si (100) and (111) substrate using a pulsed laser deposition technique. A thin layer of titanium nitride was used as a buffer medium. We characterized these films using X-ray diffraction, high resolution transmi...Tantalum nitride; Diffusion barriers; Copper diffusion2002
3 Tiwari, AshutoshCopper diffusion characteristics in single crystal and polycrystalline TaNTaN has become a very promising diffusion barrier material for Cu interconnections, due to the high thermal stability requirement and thickness limitation for next generation ULSI devices. TaN has a variety of phases and Cu diffusion characteristics vary with different phases and microstructures. We...Diffusion barriers; Copper diffusion; Tantalum nitride2003
4 Tiwari, AshutoshEpitaxial growth of TaN films on Si(100) and Si(111) using a TiN buffer layerWe have deposited high-quality epitaxial B1 NaCl-structured TaN films on Si(100) and Si(111) substrates with TiN as the buffer layer, using pulsed laser deposition. Our method exploits the concept of lattice-matching epitaxy between TiN and TaN and domain-matching epitaxy between TiN and silicon. X...Diffusion barriers; Buffer layers; Tantalum nitride; Silicon substrate2002
5 Tiwari, AshutoshCopper diffusion characteristics in single-crystal and polycrystalline TaNWe have investigated the diffusivity of copper in single-crystal (NaCl-structured) and polycrystalline TaN thin films grown by pulsed-laser deposition. Polycrystalline TaN films were grown directly on Si(100), while single-crystal films were grown with TiN buffer layers. Both poly- and single-crysta...Diffusion barriers; Copper diffusion; Tantalum nitride2002
6 Tiwari, AshutoshStress-induced tuning of metal-insulator transition in NdNiO3 filmsWe have used the lattice-mismatch epitaxial strain, induced by the constraint of epitaxy, to tune the metal-insulator (M- I) transition temperature of NdNiO3 films grown on Si(100) substrate. Films were integrated with the Si(100) substrate using several combinations of thin buffer layers. A system...NdNiO3; Silicon substrate; Tantalum nitride; Buffer layers; Biaxial strain2002
7 Tiwari, AshutoshGrowth and characterization of TaN/TiN superlattice structuresEpitaxial B1 NaCl-structured TaN(3 nm)/TiN(2 nm) superlattice structures were grown on Si(100) substrates with a TiN buffer layer, using pulsed-laser deposition. A special target assembly was used to manipulate the thickness of each layer. X-ray diffraction, transmission electron microscopy, and ...Diffusion barriers; Copper diffusion; Tantalum nitride2003
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