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 | Balasubramonian, Rajeev | Leveraging 3D technology for improved reliability | Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower supply voltages have increased the vulnerability of computer systems towards transient faults. An increase in within-die an... | Reliability; Redundant multi-threading, 3D die-stacking; Parameter variation; Soft errors; Dynamic timing errors; Power-efficient microarchitecture; On-chip temperature | 2007-12 |