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1 Rieth, Loren WPlasma-assisted atomic layer deposition of Al2O3 and parylene C bi-layer encapsulation for chronic implantable electronicsEncapsulation of biomedical implants with complex three dimensional geometries is one of the greatest challenges achieving long-term functionality and stability. This report presents an encapsulation scheme that combines Al2O3 by atomic layer deposition with parylene C for implantable electronic sys...2012-01-01
2 Stevens, KennethRadiation hardening by design of asynchronous logic for hostile environmentsA wide range of emerging applications is driving the development of wireless sensor node technology towards a monolithic system-on-a-chip implementation. Of particular interest are hostile environment scenarios where radiation and thermal extremes exist. Radiation hardening by design has been recogn...2009
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