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Creator | Title | Description | Subject | Date |
1 |
 | Normann, Richard A.; Horch, Kenneth W.; Cha, Kichul | Mobility performance with a pixelized vision system | A visual prosthesis, based on electrical stimulation of the visual cortex, has been suggested as a means for partially restoring functional vision in the blind. The prosthesis would create a pixelized visual sense consisting of punctate spots of light (phosphenes). The present study investigated the... | Visual Prosthesis; Mobility; Phosphene Simulator | 1992 |
2 |
 | Normann, Richard A.; Abbasi, Masoud; Johansson,Torbjorn | Silicon carbide enhanced thermomigration | The widespread acceptance of thermomigration technology to produce through-chip interconnects has been impaired by (i) a random walk of the Si-Al liquid eutectic inclusion as it traverses the wafer, and (ii) a ?surface barrier? which allows thermomigration of only relatively large inclusions. In ... | Silicon Dioxide; Thermometers; Transducers; Thermomigration Technology; Infrared Lamps | 1992 |
3 |
 | Normann, Richard A.; Johansson,Torbjorn; Abbasi, Masoud; Huber, Robert J. | Three-dimensional architecture for a parallel processing photosensing array | A three-dimensional architecture for a photosensing array has been developed. This silicon based architecture consists of a 10 x 10 array of photosensors with 80 microns diameter, through chip interconnects to the back side of a 500 microns thick silicon wafer. Each photosensor consists of a 300 x 3... | Retina; Optics; Silicon; Photosensing | 1992 |