Scanning thermal profiler

Update Item Information
Publication Type Journal Article
School or College College of Science
Department Physics
Creator Williams, Clayton C.
Other Author Wickramasinghe, H. K.
Title Scanning thermal profiler
Date 1986
Description A new high-resolution profilometer has been demonstrated based upon a noncontacting nearfield thermal probe. The thermal probe consists of a thermocouple sensor with dimensions approaching 100 nm. Profiling is achieved by scanning the heated sensor above but close to the surface of a solid. The conduction of heat between tip and sample via the air provides a means for maintaining the sample spacing constant during the lateral scan. The large difference in thermal properties between air and solids makes the profiling technique essentially independent of the material properties of the solid. Noncontact profiling of resist and metal films has shown a lateral resolution of 100 nm and a depth solution of 3 nm. The basic theory of the new probe is described and the results presented.
Type Text
Publisher American Institute of Physics (AIP)
Journal Title Applied Physics Letters
Volume 49
Issue 23
First Page 1587
Last Page 1589
DOI 10.1063/1.97288
citatation_issn 36951
Subject Thermal probe; Scanning thermal profiler
Subject LCSH Van der Waals forces; Profilometer
Language eng
Bibliographic Citation Williams, C.C., & Wickramasinghe, H. K. (1986). Scanning thermal profiler. Applied Physics Letters, 49(23), Dec., 1587-9.
Rights Management (c)American Institute of Physics. The following article appeared in Williams, C.C., & Wickramasinghe, H. K., Applied Physics Letters, 49(23), 1986 and may be found at http://dx.doi.org/10.1063/1.97288
Format Medium application/pdf
Format Extent 250,924 bytes
Identifier ir-main,8587
ARK ark:/87278/s6w38dd0
Setname ir_uspace
ID 702459
Reference URL https://collections.lib.utah.edu/ark:/87278/s6w38dd0
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