Publication Type |
pre-print |
School or College |
College of Engineering |
Department |
Electrical & Computer Engineering |
Creator |
Mastrangelo, Carlos H. |
Other Author |
Banerjee, N.; Xie, Y.; Rahman, M. M.; Kim, H. |
Title |
From chips to dust: the MEMS shatter secure chip |
Date |
2014-01-01 |
Description |
This paper presents the implementation of a transience mechanism for silicon microchips via low-temperature post-processing steps that transform almost any electronic, optical or MEMS substrate chips into transient ones. Transience is achieved without any hazardous or explosive materials. Triggered chip transience is achieved by the incorporation of a distributed, thermally-activated expanding material on the chip backside. When heated at 160oC the expanding material produces massive chip cleavage mechanically shattering the chip into a heap of silicon dust. |
Type |
Text |
Publisher |
Institute of Electrical and Electronics Engineers (IEEE) |
Issue |
1123 |
First Page |
1126 |
Language |
eng |
Bibliographic Citation |
Banerjee, N., Xie, Y., Rahman, M. M., Kim, H., & Mastrangelo, C. H. (2014). From chips to dust: the MEMS shatter secure chip. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 6765843, 1123-6. |
Rights Management |
(c) 2014 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. |
Format Medium |
application/pdf |
Format Extent |
3,049,381 bytes |
Identifier |
uspace,18670 |
ARK |
ark:/87278/s6vm7nbg |
Setname |
ir_uspace |
ID |
712540 |
Reference URL |
https://collections.lib.utah.edu/ark:/87278/s6vm7nbg |