Publication Type |
Journal Article |
School or College |
College of Science |
Department |
Physics |
Creator |
Williams, Clayton C. |
Other Author |
Wickramasinghe, H. K. |
Title |
High resolution thermal microscopy |
Date |
1986 |
Description |
A new high resolution thermal microscope has been demonstrated capable of imaging thermal fields with sub 1000 angstom resolution. It is based upon a non-contacting near field thermal probe. The thermal probe consists of a thermocouple sensor on the end of a tip with sub 1000 angstrom dimensions. The probe tip is scanned in close proximity to a solid or liquid surface and the local temperature is mapped with a resolution determined by the size of the tip. Material independent surface profiling has also been demonstrated with the thermal probe, providing a lateral resolution of approximately 300 angstroms. Temperature mapping and surface profiling results are presented on both electronic and biological materials. |
Type |
Text |
Publisher |
Institute of Electrical and Electronics Engineers (IEEE) |
First Page |
393 |
Last Page |
397 |
Language |
eng |
Bibliographic Citation |
Williams, C. C., & Wickramasinghe, H. K. (1986). High resolution thermal microscopy. Ultrasonics Symposium Proceedings, 393-7. |
Rights Management |
(c) 1986 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. |
Format Medium |
application/pdf |
Format Extent |
412,831 bytes |
Identifier |
ir-main,8588 |
ARK |
ark:/87278/s6g73zbg |
Setname |
ir_uspace |
ID |
706637 |
Reference URL |
https://collections.lib.utah.edu/ark:/87278/s6g73zbg |