Microarchitectural techniques to reduce interconnect power in clustered processors

The paper presents a preliminary evaluation of novel techniques that address a growing problem - power dissipation in on-chip interconnects. Recent studies have shown that around 50% of the dynamic power consumption in modern processors is within on-chip interconnects. The contribution of interconnect power to total chip power is expected to be higher in future communication-bound billion-transistor architectures. In this paper, we propose the design of a heterogeneous interconnect, where some wires are optimized for low latency and others are optimized for low power. We show that a large fraction of on-chip communications are latency insensitive. Effecting these non-critical transfers on low-power long-latency interconnects can result in significant power savings without unduly affecting performance. Two primary techniques are evaluated in this paper: (i) a dynamic critical path predictor that identifies results that are not urgently consumed, and (ii) an address prediction mechanism that requires addresses to be transferred off the critical path for verification purposes. Our results demonstrate that 49% of all interconnect transfers can be effected on power-efficient wires, while incurring a performance penalty of only 2.5%.