| Description |
Uniform deposits are typically desired in electrodeposition; however, the geometry of the deposited surface often makes a uniform deposit difficult to achieve. The objectives of this thesis are to provide experimental and modeling data for deposit uniformity of several geometries in a copper sulfate solution and to create a model capable of predicting deposit uniformity on any geometry. Bench scale electroplating cells were set up to test deposit distributions of multiple geometries as well as to test deposit uniformity with varying copper concentrations and temperatures ranging from 30 g/L to 50 g/L Cu2+ and 30 °C to 60 °C. The deposit uniformity was determined by cross- sectioning the samples. Models were generated using a finite element analysis-based software package named COMSOL Multiphysics. The model results were compared to experimental results to verify model accuracy. Model results were determined to be accurate as long as the cathode size was not too small. In addition, a numerical model was developed based on cell geometry, current density, and limiting current density. This numerical model was compared with the COMSOL model, and the results show very good agreement between the two models. Results from the electrodeposition experiments, COMSOL model, and numerical model can be used to predict copper electrodeposition profiles and uniformity in a wide range of conditions and geometries. |
