Boule shaping of single crystal silicon carbide by wire electrical discharge machining

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Title Boule shaping of single crystal silicon carbide by wire electrical discharge machining
Publication Type thesis
School or College College of Engineering
Department Mechanical Engineering
Author Newman, Devon K
Date 2010-07
Description Wire electric discharge machining (WEDM) has proven to be a useful technology in the processing of semiconductor materials for micro-electronics and MEMS applications. The technology has been shown to reduce processing costs by improving material utilization, eliminating defects, and simplifying the manufacturing process. The intent of this investigation was to apply WEDM to the shaping of a single-crystal silicon carbide (SiC) boule with the goal of reducing the cost associated with boule shaping. In micro-electronic systems, SiC has been shown to be well suited for applications in extreme operating conditions such as high-temperature or adverse chemical environments. SiC is a material of very high hardness, which means it is a difficult material to machine by mechanical means. SiC is an important material for the future of electronic devices, but the use of SiC is limited by the difficulty and high cost associated with production of SiC substrates.
Type Text
Publisher University of Utah
Subject Boule; Carbide; Silicon; WEDM
Subject LCSH Silicon carbide - Machining; Electric metal-cutting
Dissertation Institution University of Utah
Dissertation Name MS
Language eng
Rights Management ©Devon K. Newman
Format application/pdf
Format Medium application/pdf
Format Extent 3,875,806 bytes
Source Original in Marriott Library Special Collections, TK7.5 2010 .N488
ARK ark:/87278/s6s18h3k
Setname ir_etd
ID 193533
Reference URL https://collections.lib.utah.edu/ark:/87278/s6s18h3k
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