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1 Effects of weak extremely low frequency magnetic fields on calcium/calmodulin interactions.Mechanisms by which weak electromagnetic fields may affect biological systems are of current interest because of their potential health effects. Lednev has proposed an ion parametric resonance hypothesis (Lednev, 1991, Bioelectromagnetics, 12:71-75), which predicts that when the ac, frequency of a c...Electromagnetic Fields; Calcium-binding Proteins; Lednev's Theory1996-06
2 Robust estimation of fetal heart rate variability using Doppler ultrasound.This paper presents a new measure of heart rate variability (HRV) that can be estimated using Doppler ultrasound techniques and is robust to variations in the angle of incidence of the ultrasound beam and the measurement noise. This measure employs the multiple signal characterization (MUSIC) algori...Prenatal Ultrasonography; Fetal Heart Rate; Blood Flow Velocity; Algorithms2003-08
3 Silicon carbide enhanced thermomigrationThe widespread acceptance of thermomigration technology to produce through-chip interconnects has been impaired by (i) a random walk of the Si-Al liquid eutectic inclusion as it traverses the wafer, and (ii) a ?surface barrier? which allows thermomigration of only relatively large inclusions. In ...Silicon Dioxide; Thermometers; Transducers; Thermomigration Technology; Infrared Lamps1992
4 Silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode arrayA method has been developed for the manufacture of a "three-dimensional" electrode array geometry for chronic intracortical stimulation. This silicon based array consists of a 4.2 x 4.2 x 0.12 mm thick monocrystalline substrate, from which project 100 conductive, silicon needles sharpened to facilit...Electric Stimulation; Electrodes, Implanted; Sensory Cortex; Intracortical Electrode Array1991
5 Three-dimensional architecture for a parallel processing photosensing arrayA three-dimensional architecture for a photosensing array has been developed. This silicon based architecture consists of a 10 x 10 array of photosensors with 80 microns diameter, through chip interconnects to the back side of a 500 microns thick silicon wafer. Each photosensor consists of a 300 x 3...Retina; Optics; Silicon; Photosensing1992
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