Bi-layer encapsulation of Utah array based nerual interfaces by atomic layer deposited Al2O3 and parylene C

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Publication Type pre-print
School or College College of Engineering
Department Electrical & Computer Engineering
Creator Rieth, Loren W
Other Author Xie, Xianzong; Cardwell, Ryan; Sharma, Rohit; Yoo, Je-Min; Diweka, Mohit; Tathireddy, Prashant; Solzbacher, Florian
Title Bi-layer encapsulation of Utah array based nerual interfaces by atomic layer deposited Al2O3 and parylene C
Date 2013-01-01
Description We present a novel coating method that combines atomic layer deposited Al2O3 and Parylene C for encapsulation of biomedical implantable devices, focusing on its application on Utah electrode array based neural interfaces. The alumina and Parylene C bi-layer encapsulated wired Utah electrode array showed relatively stable impedance during the 320 days of soak testing at 37 °C in phosphate buffered solution. Also bi-layer coated fully integrated Utah array based wireless neural interfaces had stable power-up frequency and constant RF signal strength during the 600 days of equivalent soaking time at 37 °C. Bi-layer coated Utah arrays had constant current drawing of about 3 mA during 140 days of soak testing.
Type Text
Publisher Institute of Electrical and Electronics Engineers (IEEE)
First Page 1267
Last Page 1270
Language eng
Bibliographic Citation Xie, X., Rieth, L., Cardwell, R., Sharma, R., Yoo, J.-M., Diweka, M., Tathireddy, P., & Solzbacher, F. (2013). Bi-layer encapsulation of utah array based nerual interfaces by atomic layer deposited Al2O3 and parylene C. 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, 1267-70.
Rights Management (c) 2013 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Format Medium application/pdf
Format Extent 860,719 bytes
Identifier uspace,18377
ARK ark:/87278/s67t0xp3
Setname ir_uspace
Date Created 2014-02-24
Date Modified 2021-05-06
ID 711376
Reference URL https://collections.lib.utah.edu/ark:/87278/s67t0xp3
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