Three-dimensional architecture for a parallel processing photosensing array

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Publication Type Journal Article
School or College School of Medicine; College of Engineering
Department Mechanical Engineering; Ophthalmology; Electrical & Computer Engineering; Surgery; Bioengineering; Physiology
Creator Normann, Richard A.; Johansson,Torbjorn; Abbasi, Masoud; Huber, Robert J.
Title Three-dimensional architecture for a parallel processing photosensing array
Date 1992
Description A three-dimensional architecture for a photosensing array has been developed. This silicon based architecture consists of a 10 x 10 array of photosensors with 80 microns diameter, through chip interconnects to the back side of a 500 microns thick silicon wafer. Each photosensor consists of a 300 x 300 microns pn-junction photodiode. The following processes were used to create this photosensing architecture: 1) thermomigration of aluminum pads through an n-type silicon wafer; 2) creation of pn-junction photosensors on one side of the wafer; and 3) creation of aluminum pad ohmic contacts to the thermomigrated, through chip interconnects and the substrate on the back side of the wafer. The electrical and optical characteristics of the three-dimensional architecture indicates that it should be well suited as a photosensing framework around which a "silicon retina" could be built.
Type Text
Publisher Institute of Electrical and Electronics Engineers (IEEE)
Volume 39
Issue 12
First Page 1292
Last Page 1297
Subject Retina; Optics; Silicon; Photosensing
Subject MESH Retina; Optics; Artificial Organs
Language eng
Bibliographic Citation Johansson T, Abbasi M, Huber RJ, Normann RA. (1992). A three-dimensional architecture for a parallel processing photosensing array. IEEE Trans Biomed Eng, 39(12), 1292-7
Rights Management © Institute of Electrical and Electronics Engineers (IEEE)
Format Medium application/pdf
Identifier ir-main,12727
ARK ark:/87278/s644651x
Setname ir_uspace
ID 706396
Reference URL https://collections.lib.utah.edu/ark:/87278/s644651x
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