Silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array

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Publication Type Journal Article
School or College School of Medicine; College of Engineering
Department Ophthalmology; Surgery; Electrical & Computer Engineering; Bioengineering; Physiology
Creator Normann, Richard A.; Campbell, Patrick K.; Jones, Kelly E.; Huber, Robert J.; Horch, Kenneth W.
Title Silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array
Date 1991
Description A method has been developed for the manufacture of a "three-dimensional" electrode array geometry for chronic intracortical stimulation. This silicon based array consists of a 4.2 x 4.2 x 0.12 mm thick monocrystalline substrate, from which project 100 conductive, silicon needles sharpened to facilitate cortical penetration. Each needle is electrically isolated from the other needles, and is about 0.09 mm thick at its base and 1.5 mm long. The sharpened end of each needle is coated with platinum to facilitate charge transfer into neural tissue. The following manufacturing processes were used to create this array. 1) Thermomigration of 100 aluminum pads through an n-type silicon block. This creates trails of highly conductive p+ silicon isolated from each other by opposing pn junctions. 2) A combination of mechanical and chemical micromachining which creates individual penetrating needles of the p+ silicon trails. 3) Metal deposition to create active electrode areas and electrical contact pads. 4) Array encapsulation with polyimide. The geometrical, mechanical, and electrical properties of these arrays should make them well suited as interfaces to cortical tissue.
Type Text
Publisher Institute of Electrical and Electronics Engineers (IEEE)
Volume 38
Issue 8
First Page 758
Last Page 768
Subject Electric Stimulation; Electrodes, Implanted; Sensory Cortex; Intracortical Electrode Array
Subject MESH Biocompatible Materials; Electric Conductivity; Somatosensory Cortex
Language eng
Bibliographic Citation Campbell PK, Jones KE, Huber RJ, Horch KW, Normann RA. (1991). A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array. IEEE Trans Biomed Eng, 38(8), 758-68
Rights Management © Institute of Electrical and Electronics Engineers (IEEE)
Format Medium application/pdf
Identifier ir-main,12725
ARK ark:/87278/s6x35fp5
Setname ir_uspace
Date Created 2012-06-13
Date Modified 2012-06-13
ID 703597
Reference URL https://collections.lib.utah.edu/ark:/87278/s6x35fp5
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