||Advances in neural interfaces are putting digitization electronics closer to the patient. Since a fully implantable system is desired, there is need for a viable method for encapsulating electronics intended for implantation using a soft encapsulation method. For this thesis, several encapsulation methods were tested. Testing was split into three phases: a viability phase, a preliminary phase, and a verification phase. In the viability and preliminary phases, a method using layered Parylene C and polydimethylsiloxane was identified as having the best barrier properties. This method, along with strict attention to the cleanliness of the device, yielded very promising results. During the verification phase, devices encapsulated using this layered approach with strict attention to cleanliness performed well after going through thorough soak testing.